Elon Musk has never been shy about grand comparisons, but his latest claim pushes even his own scale of ambition. He now ...

The Galaxy Z TriFold arrives as the most radical rethink of the smartphone since the first modern foldables, promising to ...

Researchers have created a new kind of 3D computer chip that stacks memory and computing elements vertically, dramatically ...

An agentic AI-based approach to end-to-end bug resolution using both error logs and waveforms.

Ensuring that verification platforms can scale with industry demands and support new use cases as they emerge.

Engineering work was built around the strength of precision assembly, and mechanical reliability. Increasingly, a car's ...

His work is helping UC San Diego become a driving force in the nation’s growing semiconductor innovation ecosystem. Photo by ...

Terra Innovatum Global faces significant regulatory, cost, and execution risks, with FOAK commercialization by 2027 highly ...

Stanford, CMU, Penn, MIT, and SkyWater Technology reached a major milestone by producing the first monolithic 3D chip ...

An analysis of Tesla’s patent applications shows a slower pace of innovation in the last 2 years and a shift toward AI ...

The sixth in a series of articles recapping key sessions from the Data Center Frontier Trends Summit 2025 (Aug. 26–28), held ...

Quantum information science is no longer confined to chalkboards and controlled laboratory tests. You now see working quantum ...