Samsung phones are packed with smart features, but many people overlook them. Here are a few that make a big impact.

Abstract: 2.5D/3D stacked heterogeneous integration packages, like CoWoS (Chip on Wafer on Substrate) technology, are increasingly adopted in high-performance computing (HPC) for data centers and AI ...

Follow ZDNET: Add us as a preferred source on Google. Can you believe that the first Roku device launched 17 years ago? It was initially developed in partnership with Netflix to stream its "Watch ...

Abstract: The precision and robustness of visual odometry tasks for aerial robots may be compromised in featureless environments. To achieve robust visual odometry for micro aerial vehicles, it is ...