Advanced packaging technologies are reshaping how compute platforms are conceived, optimized, and manufactured.
Pravin Desale, Head of R&D, to Deliver Keynote on Growing Need for Low Power FPGAs ‒ ‒ Multiple Technical Sessions Focused on Edge AI, Sensor Fusion, System Design, and More ‒ ...
Abstract: This work presents a 180nm BCD technology platform with 1.8V/5V CMOS, BJT, 8-65V isolated LDMOS (Lateral Double-Diffused MOSFET) and other devices such as diodes, resistors, capacitors etc., ...