Abstract: This work studies a 3-D stacking approach to silicon carbide (SiC) integrated circuit (IC) chips using flip-chip technology with gold (Au) stud bumps for high-temperature (up to 600 °C) ...
From traditional fuses to eFuses, understanding the advantages, limitations, and use cases of each technology helps engineers ...
Apple now has additional time to allow for tariffs on Chinese semiconductors, thanks to a delay on any actual cost impact ...
Abstract: This manuscript provides a comprehensive review of the design, implementation, and advancements in integrated circuits (ICs) for electrochemical sensing, with a focus on biomedical and ...
Morning Overview on MSN
This programmable robot is so tiny you might miss it entirely
The newest generation of microrobots is so small that a single unit can perch on the ridge of a fingerprint and practically ...
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