Abstract: This work studies a 3-D stacking approach to silicon carbide (SiC) integrated circuit (IC) chips using flip-chip technology with gold (Au) stud bumps for high-temperature (up to 600 °C) ...
Abstract: This paper presents a hybrid control strategy that integrates fuzzy logic-based Maximum Power Point Tracking (MPPT) with a battery-supercapacitor Hybrid Energy Storage System (HESS) to ...
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