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Built for engineers and hobbyists who want to move quickly from idea to fabrication, offering intuitive design tools, ...

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Abstract: Analyzed the overall system reliability by coupling the effects of multi-physical field conditions. Proposed a method of finite element multi-physical fields whole-process analysis for ...

Increasing electronic packaging density leads to a greater need for precise thermal management. Hence, for electrical ...

New technologies, sustainable materials, and advanced digital capabilities designed to strengthen UK manufacturing and electronics supply chains.

A new generation of AI-driven inspection systems is pushing electronics manufacturing closer to zero-defect production, with ...

The New Miniature SMT Test Point from Keystone Electronics Corp. features a symmetrical flat-wire design that supports ...

Southern Manufacturing & Electronics 2026 is set to host “one of its most innovation-driven editions yet”, as exhibitors unveil new technologies, sustainable <a ...

PCBAIR announced the launch of its advanced 8-layer Glass Core PCB manufacturing capabilities, combining proprietary Through Glass Via (TGV) technology with multi-layer redistribution layers (RDL).

Abstract: Solder paste printing position offset is a common type of defective printed circuit boards (PCBs) printing, and accurate position offset prediction helps to avoid the production of defects, ...

India requires additional investments of ₹10,000–15,000 crore in printed circuit board (PCB) manufacturing over the next two to three years to bring the country’s import dependence below 50%, ...