Researchers have created a new kind of 3D computer chip that stacks memory and computing elements vertically, dramatically ...

Engineers from Stanford University, Carnegie Mellon University, University of Pennsylvania, and the Massachusetts Institute of Technology worked with ...

Twenty-six letters, twelve months, and more plot twists than a season finale. That was 2025 in technology—a year when Chinese AI labs shocked Silicon Valley, when the thinnest iPhone ever made ...

Two-dimensional (2D) materials were once regarded as important candidates for extending semiconductor scaling. Because they ...