Department of Chemistry and Chemical Engineering, Key Laboratory for Preparation and Application of Ordered Structural Materials of Guangdong Province, Shantou University, Shantou 515063, P. R. China ...
Abstract: Cu-Cu direct bonding at low temperature with Cr wetting layer and Au passivation has been developed, and the bonding mechanism has been investigated. A chip-level Cu-to-Cu direct bonding can ...
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