Nanorobots using plasmonic motors achieve high-speed propulsion and precise control, enabling efficient bacterial capture and transport in biological settings.

Abstract: This paper presents a 3D model of a photoconductive antenna (PCA) on semiconductor substrate. The simulations were conducted using the COMSOL Multiphysics package. The model considers the ...

With a third of the global supply offline because of the war in Iran, gas companies are scrambling to assure critical A.I. chip makers there will be no disruptions. Air Liquide supplies helium and ...

Synopsys’ Jayraj Nair checks out how a model-based systems engineering workflow can help manage the complex multiphysics analysis needed to optimize heterogeneous systems. Siemens’ Melville Bryant ...

U.S. and allied export controls on advanced semiconductor technologies, imposed beginning in 2022, were designed to constrain China’s AI and high-end chip development. While progress on these goals ...

Taiwan Semiconductor Manufacturing has grown its market share amid the AI boom. ASML is a publicly traded monopoly on extreme ultraviolet lithography. Arm Holdings is gobbling up market share, though ...

Forbes contributors publish independent expert analyses and insights. Marco Chiappetta is a technologist who covers semiconductors and AI. This voice experience is generated by AI. Learn more. This ...

BURLINGTON, Mass., March 11, 2026 (GLOBE NEWSWIRE) -- COMSOL, an independently-owned global leader in modeling and simulation software, today announced the locations of its worldwide COMSOL Conference ...

A prolonged conflict in the Middle East could disrupt supplies of key chipmaking elements such as helium and bromine, analysts told CNBC. Higher energy costs could also dampen demand for AI data ...

Complementary leading technologies combine to deliver comprehensive physical system design and AI-driven analysis solutions Cadence (Nasdaq: CDNS) today announced that it has completed its previously ...

Abstract: The increase in operating voltage levels of power modules due to the adoption of wide bandgap semiconductor materials increases the risk of insulation breakdown and partial discharge.