Product development is inherently complex work. The teams that do it best understand that conflict is not only unavoidable ...

Researchers have created a new kind of 3D computer chip that stacks memory and computing elements vertically, dramatically ...

An agentic AI-based approach to end-to-end bug resolution using both error logs and waveforms.

Find out why engineers in the fields of electrical and electronic engineering (EE and ECE) are referred to as 'Circuit ...

Ensuring that verification platforms can scale with industry demands and support new use cases as they emerge.

Although cryptographic standards are evolving in response to quantum threats, the industry recognises that software cannot ...

Memory swizzling is the quiet tax that every hierarchical-memory accelerator pays. It is fundamental to how GPUs, TPUs, NPUs, ...

India’s cloud is not only virtual — it is increasingly physical, resource-intensive and expanding at an extraordinary pace.

A cross-institutional team led by researchers from the Department of Electrical and Electronic Engineering (EEE), under the ...

Vikas Jodigatte Nagaraj pushes for rigor, efficiency, and environmental awareness in engineering—and he believes in breaking down the walls between hardware and software. That mind-set keeps shaping ...

Stanford, CMU, Penn, MIT, and SkyWater Technology reached a major milestone by producing the first monolithic 3D chip ...

Verification engineers tackling complex SoCs and FPGA designs can now simulate, debug, and optimize with greater speed and confidence, discover how its high-performance engines, broad language support ...