Scientists in China have investigated the fracture strength of commercial G12 monocrystalline wafers via the 4-point bending test and have found that wafer thickness, the position of the silicon wafer ...

PORTLAND, Ore.--(BUSINESS WIRE)--Electro Scientific Industries, Inc. (NASDAQ:ESIO), an innovator in laser-based micromachining solutions, today unveiled its Ultrus TM laser processing system, designed ...

A silicon wafer is a thin slice of crystalline silicon typically grown using the Czochralski process, which involves pulling a crystal seed from a molten silicon bath. A silicon wafer is a thin slice ...

Major processes in semiconductor wafer fabrication: 1) wafer preparation, 2) pattern transfer, 3) doping, 4) deposition, 5) etching, and 6) packaging. The process of creating semiconductors can be ...

With a new type of laser, wafers can be processed 10 to 20 times faster than before. This is the result of a research project at the Fraunhofer Institute for Solar Energy Systems (Fraunhofer ISE) in ...

Oct 29, 2024, Munich – 29 October 2024 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) announced it has unveiled an advance in handling and processing “the thinnest silicon power wafers ever ...

Device level SiC wafers require a systematic process including single crystal growth, wire cutting, lapping or grinding, and chemical mechanical polishing. SiC wafers have important application value ...

Reliable versatile analog transistor targets More Than Moore applications bringing differential advantage for smart sensors, ...

Hybrid bonding is becoming the preferred approach to making heterogeneous integration work, as the semiconductor industry shifts its focus from 2D scaling to 3D scaling. By stacking chiplets ...

Semiconductor chips consist of dozens of layers, packing immense computing power into a compact form. They store and retrieve data for signaling and control and are essential in creating central ...