Abstract: Silicon interposers are providing interesting alternatives to organic packages for the fabrication of complex system in package (SIP) modules in particular for RF application. Among the ...
Nordic Semiconductor has launched a development kit designed for RF engineers to develop cellular internet of things (IoT), ...
Abstract: This paper presents two innovative packaging techniques for Monolithic Microwave Integrated Circuits (MMICs) designed for multilayer waveguide-based antennas operating near 100 GHz. The ...
The demand for satellites with sophisticated computational capabilities and reliable, robust onboard processor systems is challenging the latest ultra‑deep‑submicron FPGAs and ASICs, as well as their ...
The demand for convenient and reliable switching systems is increasing across homes, offices, and industrial environments. Conventional methods, such as wired switches and infrared (IR) remotes, have ...
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