Abstract: This work studies a 3-D stacking approach to silicon carbide (SiC) integrated circuit (IC) chips using flip-chip technology with gold (Au) stud bumps for high-temperature (up to 600 °C) ...
From traditional fuses to eFuses, understanding the advantages, limitations, and use cases of each technology helps engineers ...
Abstract: This manuscript provides a comprehensive review of the design, implementation, and advancements in integrated circuits (ICs) for electrochemical sensing, with a focus on biomedical and ...
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