Researchers have created a new kind of 3D computer chip that stacks memory and computing elements vertically, dramatically ...

LG Innotek (CEO Moon Hyuksoo) announced on December 22 that the company has successfully developed a 'Next-Generation Smart ...

Taiwan's integrated circuit design houses are accelerating shipments to the global drone market as US trade restrictions on ...

Stanford, CMU, Penn, MIT, and SkyWater Technology reached a major milestone by producing the first monolithic 3D chip ...

MediaTek Inc (聯發科), the world’s largest mobile phone chip designer, yesterday said it is working closely with Japan’s Denso ...

Unlike IC design brands, IDM companies are typically conservative regarding demand conditions for the automotive chip market. The difference is partly related to operating base levels. New entrants ...

Tata Electronics has partnered with Japan's ROHM Co. to manufacture semiconductors for both Indian and global markets. This collaboration will establish a power semiconductor manufacturing framework ...

Why it's essential to combine sign-off accuracy, iterative feedback, and intelligent automation in complex designs.

Businesses and colleges continue to advance semiconductor research and development in Texas. So far, four colleges are ...

Advanced packaging technologies are reshaping how compute platforms are conceived, optimized, and manufactured.

Engineers from Stanford University, Carnegie Mellon University, University of Pennsylvania, and the Massachusetts Institute of Technology worked with ...

As the fourth most traded product globally, electronic components have become essential to most industries. The sector, which ...