Researchers have created a new kind of 3D computer chip that stacks memory and computing elements vertically, dramatically ...
Stanford, CMU, Penn, MIT, and SkyWater Technology reached a major milestone by producing the first monolithic 3D chip ...
Businesses and colleges continue to advance semiconductor research and development in Texas. So far, four colleges are ...
Engineers from Stanford University, Carnegie Mellon University, University of Pennsylvania, and the Massachusetts Institute of Technology worked with ...
LG Innotek (CEO Moon Hyuksoo) announced on December 22 that the company has successfully developed a 'Next-Generation Smart IC (integrated circuit) Substrate' featuring enhanced performance and ...
Despite the Commodore 64 having been out of production for probably longer than many Hackaday readers have been alive, its ...
Voyant Photonics, the leader in chip-scale frequency-modulated continuous-wave (FMCW) LiDAR, today announced its Heliumtm Platform of fully solid-state LiDAR sensors and modules. The solution is built ...
In late November, airlines around the world were told to urgently ground planes within their Airbus A320 fleets.
Public records clearly shows that for the past 25 years, CERN has repeatedly built inadequate FPGA-based Level-1 Triggers, necessitating multiple rebuilds. During the Higgs boson discovery ...
Key PointsIntense solar radiation poses a serious threat to aviation electronics but can be predicted using advanced ...
Dr. Charles Greene Dr. Charles Greene is the Chief Operating and Technical Officer of Powercast Corporation, the leading provider of far-field RF-based wireless power, inductive technologies, and ...