Researchers have created a new kind of 3D computer chip that stacks memory and computing elements vertically, dramatically ...

Engineers from Stanford University, Carnegie Mellon University, University of Pennsylvania, and the Massachusetts Institute of Technology worked with ...

Samsung Electronics is poised to capitalize on US demand due to Taiwan's N-2 policy restricting TSMC's advanced process ...

Two-dimensional (2D) materials were once regarded as important candidates for extending semiconductor scaling. Because they ...

Since his postdoctoral days at MIT, Hang Yu, associate professor of materials science and engineering, has been wrestling ...

An investigation ruled that China’s inroads into the chip industry had hurt the United States. The administration delayed ...