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Abstract: The reliability of dc-link capacitors in power electronic converters is one of the critical aspects to be considered in modern power converter design. The observation of their ageing process ...

Abstract: Face-to-face (F2F) is a bonding style in three-dimensional integrated circuits (3D ICs) that bonds ICs by using the top-metal (face) as the bonding side when stacking two ICs. As technology ...

As a small business owner, Liz understands the unique challenges entrepreneurs face. Well-versed in the digital landscape, she combines real-world experience in website design, building e-commerce ...