IEEE

Process Innovations for Future Technology Nodes with Back-Side Power Delivery and 3D Device Stacking

Abstract: The recent report of a high-yielding process with Back-Side Power Delivery (BSPD) using PowerVia, the benefits obtained on an Intel E-core implementation, and the imminent deployment of ...
IEEE

Penta-Level Charge Trap-Based 3D NAND Flash Memory Enabled by Bi-Directional Step-Pulse-Programming and Improvement of Cell Channel Process

Abstract: We present PLC (Penta-level cell, 5 bits/cell) NAND flash memory using 3D charge-trap-flash (CTF) cell. To achieve PLC cell distribution with proper cell read margin, program noise and short ...
CNET

Makers Will Have Better Tools and Tech in 2026, and I Couldn't Be More Excited

Creative hobbyists, get ready for a glow-up. Here are my predictions for 3D printers, laser engravers and more.

MIT Engineers Create 3D-Printable Aluminum 5 Times Stronger Than Conventional Alloys

By applying machine learning techniques, engineers at MIT have created a new method for 3D printing metal alloys that produce ...
Tech Xplore

One pull of a string is all it takes to deploy these complex structures

MIT researchers have developed a new method for designing 3D structures that can be transformed from a flat configuration ...
Interesting Engineering on MSN

New ‘necroprinting’ uses mosquito feeding tubes for 3D printing below cell scale

A research team from McGill University and Drexel University has transformed female mosquito feeding tubes into ultra-high-resolution 3D-printing nozzles. The approach allows printers to lay down ...