Despite the Commodore 64 having been out of production for probably longer than many Hackaday readers have been alive, its ...

Abstract: This study is attempted to correlate between solder joint shape and fatigue life in experimental and numerical approaches. The test assemblies consisting of R1005 (1.0 × 0.5 mm) and R0402 (0 ...

This is the most complex or detailed soldering I've done so far, the QFN20 package is very small but still not impossible to solder using conventional tools. In this video I make a functional circuit ...

As the US–China tech confrontation drags on, discussions consistently return to chips, semiconductors, rare earths, and tariffs. Despite accelerating supply-chain decoupling and overseas clients ...

Abstract: As the packaging density of wafer-level package becomes higher, the packaging process for fan-out packaged devices have been extremely needed. The soldering reliability of board-level device ...