Abstract: In this paper, thermo-mechanical reliability of a three-dimensional (3D) package based on through-silicon-via (TSV) under different thermal cycling was investigated with finite element ...
Abstract: This paper provides the physics of failure (PoF) analysis methodology in a three-dimensional integrated circuit (3D IC) integration based on mechanical and thermo-mechanical concepts. The ...
The emergence of super wood, transparent wood, mouldable wood and wood–geopolymer hybrids is redefining the structural and functional performance of bioinspired engineered wood products. Meanwhile, ...
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