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Abstract: This paper provides the physics of failure (PoF) analysis methodology in a three-dimensional integrated circuit (3D IC) integration based on mechanical and thermo-mechanical concepts. The ...

Abstract: In this paper, thermo-mechanical reliability of a three-dimensional (3D) package based on through-silicon-via (TSV) under different thermal cycling was investigated with finite element ...

Machine Design distills the cutting-edge landscape of advanced manufacturing through the eyes of multidisciplinary engineers, covering technical insights on the foundational and emerging principles of ...

The emergence of super wood, transparent wood, mouldable wood and wood–geopolymer hybrids is redefining the structural and functional performance of bioinspired engineered wood products. Meanwhile, ...