Abstract: Because of the wide application of die top interconnects with Cu bonding wire, the weak points in SiC MOSFET power modules presented a huge difference compared to the conventional modules ...

Okay, electronics tinkerers, makers, and DIY lighting folks – this is a serious bulk deal. You get one thousand (yes, 1000!) ...

Global electricity demand is rising faster than new large power plants can be built, and the cost of that imbalance is showing up in household bills and grid instability. Instead of relying only on ...

Abstract: In this article, an innovative layout is introduced to reduce the stray inductance of the multichip power modules (MCPMs) through reverse coupling of current in parallel power loops, which ...