The Next Layer on MSN

12 essential CAD skills to master early

In this video, the presenter shares valuable CAD tips and tricks that can save you time, regardless of the software you use.
IEEE

Integration of an advanced 3D TSV with the 7nm EUV logic process

Abstract: The integration of a high aspect ratio Through Silicon Via (TSV) process with the EUV 7nm logic process was developed for the first time. The TSV and MOL to BEOL interface process was ...