The Process vs. Sin City: How Nebraska football balances glitz and grind of Las Vegas Bowl

Work vs. play. The Process vs. Sin City. Nebraska football players vow the mission will win out even amid the considerable ...
IEEE

3.5D Advanced Packaging Enabling Heterogenous Integration of HPC and AI Accelerators

Abstract: Exponential growth in the number of parameters used to train deep neural network (DNN)/machine learning (ML) models for artificial intelligence (AI) training/ inference applications requires ...
Semiconductor Engineering

When To Move To Multi-Die Assemblies

As chip designs become larger and more complex, especially for AI and high-performance computing workloads, it’s often not ...

Brown University shooting: Suspect in Brown and MIT shootings found dead as motive remains unclear

Follow live updates about the suspect accused in the Brown University shooting and an MIT professor's death days later, ...
Semiconductor Engineering

What’s Next for 2.5D Packaging?

Interposers are effectively platforms on which multiple components can be assembled — like a micro-sized PCB. The primary material today is silicon, and their sizes, even when built on older process ...