Advanced packaging technologies are reshaping how compute platforms are conceived, optimized, and manufactured.
MicroCloud Hologram Inc. (NASDAQ: HOLO), ("HOLO" or the "Company"), a technology service provider, innovatively launches a quantum-enhanced deep convolutional neural network image 3D reconstruction ...
Zyx Technology, a South Korean digital design platform provider, said Monday it has partnered with NC AI, the artificial ...
As three-dimensional integrated circuit technology becomes the architectural backbone of AI, high-performance computing (HPC) ...
Ames Tribune on MSN
ISU sculpture of Jack Trice receives prestigious national design award
A key piece of Iowa State University's art collection has been awarded a national award, continuing to highlight the impact ...
Sweden-based Endra Systems AB, an artificial intelligence and generative design startup for engineers who make buildings ...
Pioneering designer's death marks a key chapter in construction innovation, as his digitally driven methods forced ...
Restoration efforts at the long-abandoned Saenger Theatre reached a milestone this week as specialists completed a full 3D ...
Tech Xplore on MSN
Seamless tech: 'OriStitch' threads computation and 3D textiles
Could a flat piece of fabric hold a 3D shape, the way paper does in origami? Aiming to find out, researchers from the Cornell ...
AlphaFold didn't accelerate biology by running faster experiments. It changed the engineering assumptions behind protein ...
The world’s top chipmaker wants open source AI to succeed—perhaps because closed models increasingly run on its rivals’ ...
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