Researchers have created a new kind of 3D computer chip that stacks memory and computing elements vertically, dramatically ...

ABB has released its ACS880 Virtual DrivePlus. This high-fidelity software-in-the-loop (SIL) system runs low-voltage drive control firmware to ensure accurate simulation of a drive’s behavior, ...

According to Towards Chemical and Materials Consulting ™, The global 3D printing materials market size was estimated to be USD 4.66 billion in 2025 and is projected to reach USD 31.23 billion by 2035, ...

SAN FRANCISCO, Dec 2 (Reuters) - Startup Vinci said on Tuesday it has raised $36 million to finance its business of building software that can speed chip and other hardware design by significantly ...

Rizwan Virk owns shares in Google, and in various video game companies. He is also a venture partner in Griffin Gaming Partners, a venture capital fund dedicated to investing in video game-related ...

SIMA 2, which can figure out how to solve problems inside virtual worlds, could lead to more general-purpose agents and better robots. Google DeepMind has built a new video-game-playing agent called ...

Breakthroughs, discoveries, and DIY tips sent every weekday. Terms of Service and Privacy Policy. Despite how it may feel some days, we probably aren’t stuck in a ...

If such a simulation were possible, the simulated universe could itself give rise to life, which in turn might create its own simulation. This recursive possibility makes it seem highly unlikely that ...

Shinichi Manabe, the lead programmer of Rune Factory 3 and director of Rune Factory 4, has launched a Kickstarter campaign for Farnia Village, a new life simulation game / action RPG coming to PC via ...

MILWAUKEE, Oct. 28, 2025 /PRNewswire/ -- Rockwell Automation, Inc. (NYSE: ROK), the world's largest company dedicated to industrial automation and digital transformation, today announced the launch of ...

A new technical paper titled “DeepOHeat-v1: Efficient Operator Learning for Fast and Trustworthy Thermal Simulation and Optimization in 3D-IC Design” was published by researchers at Intel Corporation, ...