TOKYO--(BUSINESS WIRE)--Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced the development of two 2.4 GHz RF transceiver technologies ...
A new single-chip Bluetooth LSI, designated the TC35654, integrates both RF and baseband circuits The chip employs a 0.18 µm CMOS process technology for the RF circuit instead of the usual bipolar ...
Time-to-market will be more important than ever in the highly competitive Bluetooth applications market. Zeevo Inc. (formerly Telencomm Inc.) now gives you a chance to be early—maybe even first—with ...
The group behind the Bluetooth standard says it’s developed a new feature that’ll allow companies to track items down to the centimeter. The group is combining Bluetooth’s existing object-tracking ...
The market for Mobile Internet Devices – the new class of Internet-connected products offering “always-on” Web browsing, photography and video, navigation, games, social networking and voice ...
Announced at ISSCC 2022: Impedance Tuning and Reference Signal Self-Correction Technologies Can Facilitate Bluetooth LE Implementation in IoT Devices TOKYO, Japan ― February 24, 2022 -- Renesas ...
SAN JOSE, Calif., December 09, 2002 -- Toshiba America Electronic Components, Inc. (TAEC) today announced a new single-chip Bluetoothâ„¢ large scale integration (LSI) that integrates radio frequency ...
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