SINGAPORE--(BUSINESS WIRE)--Kulicke and Soffa Industries, Inc. (NASDAQ: KLIC) ("Kulicke & Soffa", "K&S" or the "Company") today announced that the Company appointed Chan Pin Chong as Vice President, ...

Ball bonding, Wedge bonders, and Stud-bump bonders are popular equipment used in the industry. Integrated circuits (ICs) and semiconductor devices, made of copper, aluminum, gold, and silver, require ...

Hesse Mechatronics, Inc. (formerly Hesse & Knipps), the Americas subsidiary of Hesse GmbH, leading manufacturer of high speed fine pitch wedge bonders and fully automatic heavy wire bonders for the ...

Palomar Technologies released its 3470-II automatic wire bonder for gold or aluminum wire interconnect assembly used in military and aerospace applications. It is designed to enable deep access wedge ...