TOKYO--(BUSINESS WIRE)--Dai Nippon Printing Co., Ltd. (DNP) (TOKYO: 7912) has successfully developed a photomask manufacturing process capable of accommodating the 3-nanometer (10-9 meter) lithography ...
TOKYO--(BUSINESS WIRE)--Dai Nippon Printing Co., Ltd. (DNP, TOKYO: 7912) has begun development of a photomask manufacturing for 2-nanometer (10-9 meter) generation logic semiconductors that support ...
ASML Holding ASML, a leading manufacturer of semiconductor lithography tools, is at the center of a major shift in advanced ...
How Does EUV Lithography Work? EUV Lithography is a state-of-the-art technology in chip manufacturing that uses highly energetic ultraviolet light to carve detailed patterns onto semiconductor ...
TL;DR: TSMC will not use High-NA EUV lithography for its next-gen A14 (1.4nm) process in 2028, opting for conventional 0.33-NA EUV machines to maintain cost efficiency and complexity. This decision ...
ASML provided Intel, its first customer, with the $380 million Twinscan EXE:5000 High-NA lithography machine. Yesterday, it shipped its second High-NA EUV lithography machine to a mystery customer.
TSMC reiterated its long-known stance on next-generation High-NA EUV lithography tools at its European Technology Symposium in Amsterdam. The company does not require these highest-end lithography ...
Imec has achieved the first successful wafer-scale fabrication of solid-state nanopores using EUV lithography on 300mm wafers. This innovation transforms nanopore technology from a lab-scale concept ...
Samsung announced yesterday that its new 7nm node with EUV (Extreme Ultraviolet Lithography) is ready to begin risk production, just a week after TSMC made the same announcement. Despite the close ...
As anticipated, this year’s Advanced Lithography + Patterning Symposium was a very informative event, with many interesting papers being presented across a wide range of subjects. Many papers ...
SK Hynix plans to invest KRW2 trillion ($1.5 billion) in 2024 to introduce extreme ultraviolet (EUV) lithography equipment to cope with the new generation of memory investment in advanced process ...